Printed-Sensor-on-Chip devices - Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
Printed-Sensor-on-Chip devices - Aerosol jet deposition of thin film relative humidity sensors onto packaged integrated circuits
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DOI：
10.1016/j.snb.2017.08.086
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发表时间：
2018-02-01
影响因子：
8.4
通讯作者：
Deganello, Davide
中科院分区：
文献类型：
--
作者：
Clifford, Ben;Beynon, David;Deganello, Davide
在本文中，我们报告了集成硅元件和印刷电子元件的气溶胶喷射印刷传感平台的开发。为了演示该技术，采用直写气溶胶喷射沉积和滴铸相结合的方式在预封装集成电路的顶面和侧面制作了薄膜湿度传感器。该电阻式传感器由气溶胶喷射沉积的叉指纳米粒子银电极结构组成，其上覆盖有作为湿度敏感层的 Nafion (R) 薄膜。制造的传感器对测试范围（40% RH-80% RH）内的相对湿度变化表现出强烈的响应，并且在进行循环测试时表现出较低水平的滞后。在封装集成电路的表面和引脚上成功制造相对湿度传感器，证明了印刷电子和硅基电子器件之间的集成达到了新的水平，从而产生了片上印刷传感器设备。虽然针对湿度进行了演示，但所提出的概念预计可作为从生物传感到温度或气体监测等广泛应用的平台。 (C) 2017 年作者。由 Elsevier B.V. 出版
In this paper we report on the development of an aerosol jet printed sensing platform integrating elements of silicon and printed electronics. To demonstrate the technology, thin film humidity sensors have been fabricated over the top surface and sides of pre-packaged integrated circuits using a combination of direct-write aerosol jet deposition and drop-casting. The resistive based sensor consists of an aerosol jet deposited interdigitated nano-particle silver electrode structure overlaid with a thin film of Nafion (R) acting as a humidity sensitive layer. The fabricated sensor displayed a strong response to changes in relative humidity over the tested range (40% RH-80% RH) and showed a low level of hysteresis whilst undergoing cyclic testing. The successful fabrication of relative humidity sensors over the surface and pins of a packaged integrated circuit demonstrates a new level of integration between printed and silicon based electronics - leading to Printed-Sensor-on-Chip devices. Whilst demonstrated for humidity, the proposed concept is envisaged to work as a platform for a wide range of applications, from bio-sensing to temperature or gas monitoring. (C) 2017 The Author(s). Published by Elsevier B.V.