Mechanical Performance and Reliability of a Sn-Ag-Cu-Sb Alloy at Elevated Temperatures
Mechanical Performance and Reliability of a Sn-Ag-Cu-Sb Alloy at Elevated Temperatures
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Sn-Ag-Cu-Sb 合金在高温下的机械性能和可靠性
DOI：
10.1109/tcpmt.2021.3093562
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发表时间：
2021-07-01
影响因子：
2.2
通讯作者：
Ding, Jiaqi
中科院分区：
文献类型：
--
作者：
Chen, Zhiwen;Ma, Kun;Ding, Jiaqi
焊料互连对电子设备的可靠性至关重要。合金元素的加入对无铅钎料合金的显微组织和力学可靠性有有益的影响。本文研究了添加Sb对SAC305钎料合金力学性能的影响。通过差热分析发现，SAC-Sb焊料的熔点略高于SAC305。研究了SAC- sb和SAC 305钎料在不同温度（25℃-125℃）和应变速率(1 × 10（-4)-1 × 10(-2) 1/s）下的力学行为。结果表明，在上述试验条件下，SAC-Sb的极限抗拉强度（10 ~ 72 MPa）普遍高于SAC305的极限抗拉强度（4.54 ~ 61.5 MPa）。SAC305的屈服强度与温度呈线性关系，但由于Sb在Sn基体中的固溶强化作用，SAC305 -Sb钎料的屈服强度与温度呈非线性关系。基于SAC-Sb和SAC305钎料的力学性能，对Anand模型参数进行了估计。其次，利用该模型通过有限元建模评估了以SAC-Sb和SAC305作为芯片-定向键合铜（DBC）和DBC-基板连接材料的绝缘栅双极晶体管（IGBT）模块的热疲劳寿命。SAC-Sb焊点在一个热循环中最大非弹性应变的增幅小于SAC305焊点。结果表明，SAC-Sb焊料在恶劣的使用条件下具有较好的疲劳寿命。
Solder interconnects are essential to the reliability of electronic devices. The addition of alloying elements was reported to provide beneficial effects to the microstructure and mechanical reliability of lead-free solder alloys. In this work, the effects of Sb addition on the mechanical behavior of SAC305 solder alloy were investigated. Based on differential thermal analysis, it was observed that melting point of SAC-Sb solder was slightly higher than that of SAC305. The mechanical behavior was studied at different temperatures (25 degrees C-125 degrees C) and strain rates (1 x 10(-4)-1 x 10(-2) 1/s) for SAC-Sb and SAC 305 solders as a comparison. From the results, ultimate tensile strength of SAC-Sb (10-72 MPa) was generally higher than that of SAC305 (4.54-61.5 MPa) at the aforementioned test conditions. A linear relation between the UTS and yield strength and temperature was identified for test results of SAC305, but the relation was found to be nonlinear for SAC-Sb solder because of solution strengthening effect of Sb in the Sn matrix. Parameters of Anand model were estimated based on mechanical behavior of SAC-Sb and SAC305 solders. Next, the model was used to evaluate thermal fatigue life of an insulated gate bipolar transistor (IGBT) module with SAC-Sb and SAC305 as chip-to-directed bonding copper (DBC) and DBC-to-baseplate attachment materials by finite element modeling. The increase of maximum inelastic strain in one thermal cycle in SAC-Sb solder joints was lower than that in SAC305 solder joints. This result indicates that SAC-Sb solder can provide a considerably better fatigue life under harsh service conditions.