Tailored copper oxidation in alkaline aqueous solution after helium cation implantation
Tailored copper oxidation in alkaline aqueous solution after helium cation implantation
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DOI：
10.1016/j.apsusc.2022.153087
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发表时间：
2022-03
影响因子：
6.7
通讯作者：
Subing Yang;Y. Nakagawa;T. Shibayama
中科院分区：
文献类型：
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作者：
Subing Yang;Y. Nakagawa;T. Shibayama
控制铜氧化对铜抗氧化技术和铜氧化物制备具有重要意义。在这项研究中，Cu的氧化行为后，He+注入暴露于0.1 M的NaOH水溶液后，观察和潜在的微观结构的演变和机制进行了研究。He+注入和一些C伴随引入到Cu表面加速形成的薄氧化层在初始氧化期间，导致在随后的氧化过程中更快的初始生成和更快速的生长的CuO。此外，He+注入均匀化的Cu衬底上的CuO的分布。我们的发现将增加研究人员对铜在碱性水溶液条件下的氧化和腐蚀行为的理解，并为通过离子注入设计和生长铜氧化物纳米结构提供新的见解。
Manipulating Cu oxidation is important for Cu anti-oxidation techniques and Cu oxide fabrication. In this study, Cu oxidation behavior after He+implantation was observed after exposure to 0.1 M aqueous NaOH, and the underlying microstructural evolution and mechanism were investigated. He+implantation and some C concomitantly introduced into the Cu surface accelerated formation of a thin oxide layer during the initial oxidation period, resulting in faster initial generation and more rapid growth of CuO during the subsequent oxidation. Furthermore, He+implantation homogenized the distribution of CuO on the Cu substrate. Our findings will increase researchers’ understanding of the oxidation and corrosion behavior of Cu in aqueous alkaline conditions, and provide new insights into designing and growing Cu oxide nanostructures by ion implantation.