A new flip-chip technology for high-density packaging
A new flip-chip technology for high-density packaging
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用于高密度封装的新型倒装芯片技术
DOI：
10.1109/ectc.1996.550814
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发表时间：
1996
期刊：
影响因子：
--
通讯作者：
A. Alimonda
中科院分区：
文献类型：
--
作者：
D.L. Smith;A. Alimonda
我们使用溅射沉积和标准光刻来制造间距为 80 /spl mu/m 的悬臂式金属微弹簧阵列，并且我们已经获得了 200 个焊盘芯片面朝下粘合的 100% 电接触。对于铝垫上的钼铬弹簧，四点电阻为 0.38 /spl Omega/。由于触点本身没有粘合，并且弹簧具有高弹性柔量，因此该技术具有很强的抗机械冲击和应力的能力，可以适应配合表面的较大非平面性，有利于更换坏芯片，并且可以用于晶圆级探测。
We have used sputter-deposition and standard lithography to fabricate arrays of cantilevered metal micro-springs on 80 /spl mu/m pitch, and we have obtained 100% electrical contact to 200-pad chips bonded face-down against them. Four-point resistance is 0.38 /spl Omega/ for Mo-Cr springs on Al pads. Since the contacts themselves are not bonded and since the springs have high elastic compliance, this technology is very resistant to mechanical shock and stress, can accommodate large nonplanarity in mating surfaces, facilitates replacement of bad chips, and could be used for wafer-scale probing.