Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers
Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers
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包含 360 Gb/s 双向 850 nm 并行光收发器的 Terabit/s 级光学 PCB 链路
DOI：
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发表时间：
2012
影响因子：
4.7
通讯作者：
J. Kash
中科院分区：
文献类型：
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作者：
F. Doany;Clint L. Schow;Benjamin G. Lee;R. Budd;C. Baks;Cornelia K. Tsang;John U. Knickerbocker;R. Dangel;Benson Chan;How T. Lin;C. Carver;Jianzhuang Huang;J. Berry;D. Bajkowski;F. Libsch;J. Kash
我们在此报告高度集成的并行光收发器的设计、制造和表征，该收发器设计用于通过集成到光学印刷电路板 (o-PCB) 中的聚合物波导进行 Tb/s 级模块到模块数据传输。该并行光收发器以硅通孔硅载体为平台，将24通道垂直腔面发射激光器和光电二极管阵列与CMOS IC集成。 Si 载体还包括光学通孔（孔），用于光学接入传统表面发射 850 nm 光电器件。 48 通道 3D 收发器光芯片采用倒装芯片焊接到有机载体上，形成收发器光模块。组装了具有 24 个发射器 + 24 个接收器通道的全功能光模块，并对其进行了表征，发射器运行速度高达 20 Gb/s/ch，接收器运行速度高达 15 Gb/s/ch。 48 通道光模块的速率为 15 Gb/s，可提供 360 Gb/s 的双向聚合带宽。此外，o-PCB 是使用连接到 FR4 电子板的 48 通道柔性波导组件开发的。波导转向镜和透镜阵列的结合有利于与 o-PCB 的光耦合。使用球栅阵列工艺将光模块组装到 o-PCB 上，可提供电气和光学互连。已实现完整模块到模块光学链路的初步演示>； 20 个 10 Gb/s 的双向链路。在 15 Gb/s 时，误码率 <； 10-12 的每个方向有 15 个通道，实现了创纪录的具有 225 Gb/s 双向聚合数据速率的 o-PCB 链路。
We report here on the design, fabrication, and characterization of highly integrated parallel optical transceivers designed for Tb/s-class module-to-module data transfer through polymer waveguides integrated into optical printed circuit boards (o-PCBs). The parallel optical transceiver is based on a through-silicon-via silicon carrier as the platform for integration of 24-channel vertical cavity surface-emitting laser and photodiode arrays with CMOS ICs. The Si carrier also includes optical vias (holes) for optical access to conventional surface-emitting 850 nm optoelectronic devices. The 48-channel 3-D transceiver optochips are flip-chip soldered to organic carriers to form transceiver optomodules. Fully functional optomodules with 24 transmitter + 24 receiver channels were assembled and characterized with transmitters operating up to 20 Gb/s/ch and receivers up to 15 Gb/s/ch. At 15 Gb/s, the 48-channel optomodules provide a bidirectional aggregate bandwidth of 360 Gb/s. In addition, o-PCBs have been developed using a 48-channel flex waveguide assembly attached to FR4 electronic boards. Incorporation of waveguide turning mirrors and lens arrays facilitates optical coupling to/from the o-PCB. Assembly of optomodules to the o-PCB using a ball grid array process provides both electrical and optical interconnections. An initial demonstration of the full module-to-module optical link achieved >; 20 bidirectional links at 10 Gb/s. At 15 Gb/s, operation at a bit error ratio of <; 10- 12 was demonstrated for 15 channels in each direction, realizing a record o-PCB link with a 225 Gb/s bidirectional aggregate data rate.