Assembly of mesoscopic to macroscopic particles with optoelectronic tweezers (OET)
Assembly of mesoscopic to macroscopic particles with optoelectronic tweezers (OET)
复制标题
用光电镊子（OET）组装介观到宏观粒子
DOI：
10.1117/12.2322982
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
Neale S
中科院分区：
文献类型：
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作者：
Neale S
在本文中，我们将研究光学镊子和光电增强镊子在介观到宏观尺寸范围内组装粒子的相对优点。光学镊子提供了一种优雅的方法来控制微观粒子在三维中的位置，允许它们组装成所需的图案。当移动的颗粒大小与激光镊子的衍射极限点相似时，该技术效果良好。与此相比，光电镊子（OET）使用光导器件通过光导电场在二维空间中移动粒子。在OET器件的偏置光导体的明暗边界处，产生了高电梯度，通过介电电泳力移动粒子，其方式与标准光镊系统中的光学梯度移动粒子的方式相似。施乐公司最近报道了用光电镊子对150微米和300微米硅芯片的操作，每秒可以粗组装1000个物体，目标是创建一个用于电子组装的打印机系统。我们已经演示了商用250微米InP条纹激光模具的对准，50微米直径的焊接珠用于创建导电路径和尺寸达600 × 300 × 300微米的SMT组件。在本文中，我们将讨论剩下的挑战，包括将组装组件固定到位的不同策略。最后，我们将在尺寸范围的小端观察粒子的组装，并讨论介观粒子的大面积图案的潜在用途。
In this paper we will look at the relative merits of assembling particles in the mesoscopic to macroscopic size range with Optical Tweezers and Optoelectronically enhanced Tweezers. Optical tweezers provide an elegant method for controlling the position of microscopic particles in three dimensions, allowing their assembly into desired patterns. The technique works well when moving particle similar in size to the diffraction limited spots of the laser tweezers. In comparison to this Optoelectronic Tweezers (OET) use a light patterned photoconductive device to move particles in two dimensions through light patterned electrical fields. At light/dark boundaries on the biased photoconductor of an OET device high electrical gradients are created which move particles by dielectrophoresis forces in a similar manner to how the optical gradients move particles in a standard optical tweezers system. Xerox recently reported the manipulation of 150 and 300 micron silicon chips with optoelectronic tweezers, with coarse assembly of 1000 objects per second with the goal of creating a printer system for electronics assembly. We have demonstrated the alignment of commercial 250 micron InP stripe laser dies, 50 micron diameter solder beads for the creation of conductive paths and SMT components up to 600x300x300 microns in dimension. In this paper we will discuss the remaining challenges including different strategies for fixing the assembled components into place. Finally, we will look at the assembly of particles at the small end of the size range and discuss the potential uses for the large area patterning of mesoscopic particles.