Focal-Plane Sensor-Processor Chips
Focal-Plane Sensor-Processor Chips
复制标题
焦平面传感器处理器芯片
DOI：
10.1007/978-1-4419-6475-5
复制
发表时间：
2014
期刊：
影响因子：
4.5
通讯作者：
Á. Zarándy
中科院分区：
文献类型：
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作者：
Á. Zarándy
焦平面传感器-处理器成像设备是在同一硅芯片上彼此嵌入的传感器阵列和处理器阵列。这种紧密耦合甚至可以在微小的低功耗设备上实现超快处理，因为消除了大量传感数据的缓慢和能量昂贵的传输。该技术还可以产生局部自适应传感器阵列，它可以（类似于人类视网膜）适应单个场景中照明的大动态这本书侧重于最先进的视觉芯片的实现和应用。它提供了焦平面芯片技术，智能成像器和蜂窝波计算机的概述，沿着与当前的视觉芯片，三维传感器处理器阵列及其应用的许多例子。报道内容不仅包括设备背后的技术，还包括它们的近期和中期研究趋势。
Focal-plane sensor-processor imager devices are sensor arrays and processor arrays embedded in each other on the same silicon chip. This close coupling enables ultra-fast processing even on tiny, low power devices, because the slow and energetically expensive transfer of the large amount of sensory data is eliminated. This technology also makes it possible to produce locally adaptive sensor arrays, which can (similarly to the human retina) adapt to the large dynamics of the illumination in a single scene This book focuses on the implementation and application of state-of-the-art vision chips. It provides an overview of focal plane chip technology, smart imagers and cellular wave computers, along with numerous examples of current vision chips, 3D sensor-processor arrays and their applications. Coverage includes not only the technology behind the devices, but also their near- and mid-term research trends.