Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs
Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs
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DOI：
10.1109/tdei.2020.009041
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发表时间：
2021-02
影响因子：
3.1
通讯作者：
Boya Zhang;M. Ghassemi;Yunxiao Zhang
中科院分区：
文献类型：
--
作者：
Boya Zhang;M. Ghassemi;Yunxiao Zhang
这份手稿批判性地回顾了最近的研究，电力电子设备中使用的电绝缘材料和系统，并专注于硅凝胶，PD建模和缓解方法的电树枝。对于缓解方法，电场分级技术，如1）各种几何技术，和2）应用非线性阻尼进行了讨论。还强调了硅凝胶的替代品，如液体硅胶。报告的研究和技术差距的缺点被确定。特别是，我们表明，迄今为止进行的调查是在他们的起步阶段，针对下一代WBG功率器件的工作条件。本文将为今后的研究提供一个有用的框架和参考点。
This manuscript critically reviews recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modeling, and mitigation methods. For mitigation methods, electric field grading techniques, such as 1) various geometrical techniques, and 2) applying nonlinear dielectrics are discussed. Alternatives for silicone gel, such as liquid dielectrics, are also highlighted. The drawbacks of reported research and technical gaps are identified. In particular, we show that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices. This review will provide a useful framework and point of reference for future research.