In situ observation of ultrasonic flip-chip bonding using high-speed camera
In situ observation of ultrasonic flip-chip bonding using high-speed camera
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DOI：
10.7567/jjap.54.030204
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发表时间：
2015-03
影响因子：
1.5
通讯作者：
T. Shuto;T. Asano
中科院分区：
文献类型：
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作者：
T. Shuto;T. Asano
采用锥形Au微凸点结合超声波实现了空气环境中的室温微连接。超声键合的原位观察进行了使用高速摄像机调查键合过程的动力学。观察到在超声波应用下凸块的“软化”。建议在50 ms内实现键合。
Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. “Softening” of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.