Cryogenic quenching enhancement using a groove lattice filled with a low-thermal conductivity sealant
Cryogenic quenching enhancement using a groove lattice filled with a low-thermal conductivity sealant
复制标题
使用填充低导热率密封剂的凹槽晶格增强低温淬火
DOI:
10.1016/j.ijheatmasstransfer.2022.123247
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发表时间:
2022
影响因子:
5.2
通讯作者:
Toma Tsujino
中科院分区:
文献类型:
--
作者:
Katsuyoshi Fukiba;Yusaku Kameya;Toma Tsujino
This study proposed and evaluated a method of enhancing the boiling heat transfer of metal plates in cryogenic fluid. This method textures surfaces with a groove lattice filled with a low-thermal-conductivity sealant. First, electric discharge machining was performed to process a groove lattice on the surfaces of a copper plate. Second, the grooves were filled with a silicone sealant with low thermal conductivity. Third, sealant protruding from the grooves was removed using a cutter blade. This surface texture produced simultaneous film and nucleate boiling, making the gas film unstable. Consequently, the texture enhanced the heat transfer and shortened the chilldown time. In this study, polystyrene boards were used to enclose copper plates on all sides except the top surface, which was textured with the lattice pattern. These enclosed copper plates were soaked in liquid nitrogen. The temperature variation of the copper plates was recorded and used to calculate the heat flux. Effects of the pitch, depth of the grooves, and area ratio of copper were investigated through experiments with variable conditions. We successfully prepared a surface with the shortest chilldown time, which is approximately 1/5 times that of a bare copper plate. This surface can sustain repeated use without failure and is cost effective.