Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
复制标题
具有用于板对板互连的梯度折射率多模玻璃波导的电光背板演示器
DOI：
10.1109/ectc.2014.6897415
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
K. Lang
中科院分区：
文献类型：
--
作者：
L. Brusberg;H. Schroder;R. Pitwon;S. Whalley;Allen M. Miller;C. Herbst;J. Roder;D. Weber;K. Lang
首次演示了集成平面玻璃多模波导和可插拔光线路卡连接器的电光电路板（EOCB）。通过执行两步热离子交换过程，在市售的薄玻璃面板内图案化波导。由此产生的低损耗多模波导具有梯度折射率分布。玻璃波导面板采用成熟的工业工艺嵌入印刷电路板（PCB）的层叠层中。PCB内的切口被构造成用于组装可插拔光连接器和插座系统，以将线路卡上的基于光纤的波导连接到背板中的集成光波导。该演示平台包括一个标准化的子机架机箱和五个可插拔测试卡，这些测试卡带有可插拔光连接器，设计用于容纳光引擎。测试卡支持各种不同的数据接口，用于双向信号完整性测量。所评估的演示系统在850和1310 nm的测试波长下以10.3 Gb/s的速率进行无误码数据传输。
First time an electro-optical circuit board (EOCB) is demonstrated with integrated planar glass multimode waveguides and with optical pluggable line card connectors. The waveguides are patterned inside commercially available thin-glass panels by performing a two-step thermal ion-exchange process. The resulting low-loss multimode waveguides possess a gradient-index profile. The glass waveguide panel is embedded within the layer stack-up of a printed circuit board (PCB) using proven industrial processes. Cut-outs inside the PCB are structured for assembling a pluggable optical connector and receptacle system for connecting optical fiber based waveguides on the line cards to integrated optical waveguides in the backplane. The demonstration platform comprises a standardized sub-rack chassis and five pluggable test cards with pluggable optical connectors and designed for housing optical engines. The test cards support a variety of different data interfaces for bidirectional signal integrity measurements. The evaluated demonstrator system performed with bit error free data transmission at 10.3 Gb/s for the tested wavelengths of 850 and 1310 nm.