Electrorotation chip consisting of three-dimensional interdigitated array electrodes
Electrorotation chip consisting of three-dimensional interdigitated array electrodes
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DOI：
10.1016/j.snb.2010.11.012
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发表时间：
2011-04
影响因子：
8.4
通讯作者：
K. Ino;A. Ishida;Kumi Y. Inoue;Masatoshi Suzuki;Masahiro Koide;Masahiro Koide;T. Yasukawa;H. Shiku;T. Matsue
中科院分区：
文献类型：
--
作者：
K. Ino;A. Ishida;Kumi Y. Inoue;Masatoshi Suzuki;Masahiro Koide;Masahiro Koide;T. Yasukawa;H. Shiku;T. Matsue
我们开发了一种电旋转(ER)芯片，它具有交指阵列(IDA)电极面对面排列的三明治结构。芯片顶部和底部的这些IDA电极被正交排列，以形成2000多个正方形区域，在IDA电极之间具有旋转的电场。由于可以通过排列电连接来产生旋转电场，从而在相邻电极之间产生π/2相位差，因此在单个ER芯片中集成了大量的ER测量区域。利用该电流变芯片研究了玻璃微棒在各个测量区域的电流变特性。目前的电流变芯片被发现是一个有用的工具，可以进行高通量分析，以分析微粒的介电性质。
We have developed an electrorotation (ER) chip that has a sandwich structure in which interdigitated array (IDA) electrodes are arranged face-to-face. These IDA electrodes on the top and bottom of the chip were orthogonally arranged to form over 2000 square regions having rotating electric fields between the IDA electrodes. Since rotating electric fields can be generated by arranging the electrical connections to produce a π/2 phase difference between adjacent electrodes, a large number of measurement areas for ER were incorporated within a single ER chip. The ER properties of glass microrods at the individual measurement areas were investigated using this ER chip. The present ER chip was found to be a useful tool for performing high-throughput assays to analyze the dielectric properties of microparticles.