Toughening mechanisms and damage propagation in Architected-Interfaces
Toughening mechanisms and damage propagation in Architected-Interfaces
复制标题
架构接口中的增韧机制和损伤传播
DOI:
10.1016/j.ijsolstr.2023.112600
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发表时间:
2023-11-30
影响因子:
3.6
通讯作者:
Budzik,Michal K.
中科院分区:
文献类型:
--
作者:
Hedvard,Michelle L. S.;Dias,Marcelo A.;Budzik,Michal K.
We investigate fracture toughness of architected interfaces and their ability to maintain structural integrity and provide stable damage propagation conditions beyond the failure load. We propose theoretical and numerical frameworks to evaluate the fracture properties of architected interfaces sandwiched between two (face) materials. The microscopic geometries of these interfaces are chosen as 2D cells – pillar, tetrahedron, and hexagon – as well as their 3D counterparts – namely, pillar array, octet truss, and Kelvin cell. Our model, both numerical and analytical, exhibits a high level of accuracy in predicting the compliance before failure and failure loads. Novel results are obtained during the damage propagation regime, indicating fulfilment of the so-called fail-safe design. Some of the cell geometries unfold during fracture, thus increasing the failure load and ensuring stable and controlled damage propagation conditions.