Liquid Metal Enabled SIW Vias and RF Blocking Walls for Reconfigurable Antennas
Liquid Metal Enabled SIW Vias and RF Blocking Walls for Reconfigurable Antennas
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DOI：
10.23919/eucap53622.2022.9769614
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发表时间：
2022-03
期刊：
影响因子：
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通讯作者：
Shaker Alkaraki;Zhishu Qu;J. Kelly;A. Borja;R. Mittra;Yi Wang
中科院分区：
文献类型：
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作者：
Shaker Alkaraki;Zhishu Qu;J. Kelly;A. Borja;R. Mittra;Yi Wang
提出了一种基于基片集成波导（SIW）技术的可重构微波器件设计方法。该方法涉及从钻孔形成壁，该钻孔可以填充有液体金属以形成通孔。最后，通过设计和测试几个可重构射频开关，验证了该方法的有效性。该开关旨在用于可重构天线应用。所提出的器件的测量结果与模拟结果吻合良好，它们显示了宽带工作带宽与高效的性能。所提出的方法将在广泛的不同的可重构微波器件和电路中找到应用。
This paper presents a method for designing reconfigurable microwave devices based on substrate integrated waveguides (SIW) technology. The method involves forming walls from drill holes that can be filled with liquid metal to form vias. Furthermore, the proposed method is validated by designing and testing several reconfigurable radio frequency (RF) switches. The switches are intended to be used for reconfigurable antenna applications. The measured results for the proposed devices are in good agreement with the simulated results and they show wideband operating bandwidth with highly efficient performance. The proposed method will find application within a wide range of different reconfigurable microwave devices and circuits.