Temperature-Aware Scheduling and Assignment for Hard Real-Time Applications on MPSoCs
Temperature-Aware Scheduling and Assignment for Hard Real-Time Applications on MPSoCs
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DOI：
10.1145/1403375.1403446
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发表时间：
2008-03
影响因子：
2.8
通讯作者：
Thidapat Chantem;R. Dick;X. Hu
中科院分区：
文献类型：
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作者：
Thidapat Chantem;R. Dick;X. Hu
集成电路（IC）功率密度和温度的升高可能会阻碍多处理器片上系统（MPSoC）在硬实时系统中的应用。本文将考虑温度的实时MPSoC分配和调度问题形式化，并提出了一种基于混合整数线性规划的最优分阶段稳态解决方案，该方案考虑了调度和分配决策对MPSoC热特性的影响，以直接将芯片峰值温度降至最低。我们还引入了一个灵活的任务分配和调度启发式框架，该框架允许系统设计人员在解决大型问题实例时在精度和运行时间之间进行权衡。最后，对于具有足够松弛时间的任务集，我们表明在任务执行之间插入空闲时间可以显著进一步降低MPSoC的峰值温度。
Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This paper formalizes the temperature-aware real-time MPSoC assignment and scheduling problem and presents an optimal phased steady-state mixed integer linear programming-based solution that considers the impact of scheduling and assignment decisions on MPSoC thermal profiles to directly minimize the chip peak temperature. We also introduce a flexible heuristic framework for task assignment and scheduling that permits system designers to trade off accuracy for running time when solving large problem instances. Finally, for task sets with sufficient slack, we show that inserting idle times between task executions can further reduce the peak temperature of the MPSoC quite significantly.