Structure and mechanical properties of diamond-like carbon films with copper functional layer by cathode arc evaporation
Structure and mechanical properties of diamond-like carbon films with copper functional layer by cathode arc evaporation
复制标题
DOI：
10.1016/j.surfcoat.2012.08.024
复制
发表时间：
2012-09
影响因子：
5.4
通讯作者：
Bing Zhou;A. Rogachev;Zhubo Liu;Xiaohong Jiang;R. Shen;A. Rudenkov
中科院分区：
文献类型：
--
作者：
Bing Zhou;A. Rogachev;Zhubo Liu;Xiaohong Jiang;R. Shen;A. Rudenkov
采用直流脉冲阴极电弧等离子体技术，在硅衬底上制备了带有Cu功能层（中间层和表面层）的类金刚石碳（DLC）双层薄膜，并在真空中进行了不同温度的退火。研究了Cu功能层和退火温度对薄膜结构、形貌和力学性能的影响。结果表明，Cu功能层改变了双层微观结构，包括sp2碳簇的尺寸以及扩散层的厚度和元素分布。使用简单的三层模型来描述 Cu 层和 C 层之间的相互扩散。由于Cu/C键较弱，Cu中间层促进了双层膜中的石墨重排，并且Cu表面层可以更有效地防止石墨化。 Cu/DLC和DLC/Cu双层表面呈现出高度分散的纳米团聚体，双层的粒径和表面粗糙度很大程度上受退火温度的影响。双层的硬度和应力取决于铜功能层的位置。 DLC/Cu双层在100-400℃的低退火温度下具有相对较高的硬度和较低的应力。该结果可能对研究 DLC 双层膜中的应力松弛具有重要意义，并可用于推进具有高机械性能的 DLC 基工程材料的开发。
Using direct-current and pulsed cathode arc plasma technique, diamond-like carbon (DLC) bilayer films with Cu functional layer (interlayer and surface layer) were prepared on silicon substrate and annealed at various temperatures in vacuum. The effects of Cu functional layer and annealing temperature on the structure, morphology and mechanical properties of the films were investigated. The results showed that Cu functional layer changed the bilayers microstructure, including the size of sp2carbon clusters and the thickness and element distribution of diffusion layer. A simple three-layer model was used to describe the interdiffusion between Cu and C layers. Cu interlayer facilitated the graphitic rearrangement in bilayer films due to weak Cu/C bonds and Cu surface layer could be more effective against graphitization. Cu/DLC and DLC/Cu bilayers showed highly dispersed nano-agglomerates on the surface, and the particle size and surface roughness of the bilayers were largely affected by annealing temperature. The hardness and stress of the bilayer were dependent on the location of Cu functional layer. DLC/Cu bilayer possessed a relatively higher hardness and a lower stress at low annealing temperature of 100–400°C. The results may be of interest for studying the relaxation of stress in the DLC bilayer films and can be used in advancing the development of DLC based engineering materials with high mechanical properties.