IRAS study of surface acoustic wave effects on CO adsorbed on Cu surfaces

IRAS study of surface acoustic wave effects on CO adsorbed on Cu surfaces
复制标题

DOI:
10.1016/j.susc.2005.07.021
复制
发表时间:
2005-12-01
期刊:
影响因子:
1.9
通讯作者:
Inoue, Y
Inoue, Y
中科院分区:
化学3区
文献类型:
--
作者:
Nishiyama, H;Inoue, Y

文献摘要

被引文献

相似文献

声表面波(SAW)被发现有影响的CO在薄膜铜表面上的吸附状态。在10(-5)Pa和123 K下,CO在主要暴露Cu(I11)面的退火表面上的吸附在2070 cm(-1)处有一个单峰。声表面波的传播降低了峰的强度。CO在溅射Cu表面上的吸附在2072、2086、2096和2104 cm(-1)处产生四个峰:前三个峰分别归属于CO在Cu(111)、Cu(100)和Cu(110)表面上的伸缩振动,而2104 cm(-1)处的峰归属于CO在高指数面上的台阶位.随着SAW传播,CO吸附在低指数面上的强度降低,而CO吸附在高指数面上的强度显著增加,而频率没有明显的偏移。峰强度的变化在SAW开启和SAW关闭时是可逆的。从以前的研究结果,即SAW引起的低指数平面的功函数的增加和高指数平面的功函数的减少的比较,SAW引起的峰值强度变化与功函数的变化相关联。SAW通过影响金属表面的电子结构,对CO的吸附态产生显著的影响。(c)2005 Elsevier B. V.保留所有权利。
Surface acoustic wave (SAW) was found to have an effect on the adsorbed states of CO on a thin film Cu surface. The adsorption of CO at a pressure of 10(-5) Pa and at 123 K on an annealed surface mainly exposing Cu(I 11) plane provided a single peak at 2070 cm(-1). The SAW propagation decreased the intensity of the peak. The CO adsorption on a sputtered Cu surface yielded four peaks at 2072, 2086, 2096 and 2104 cm(-1): the former three peaks were assigned to the stretching vibration of CO adsorbed on Cu(111), Cu(100), and Cu(110), respectively, whereas a peak of 2104 cm(-1) to CO on high index planes involving step sites. With SAW-propagation, the intensity of CO adsorbed on the low index planes decreased, whereas that of CO adsorbed on the high index planes considerably increased with no significant shifts of the frequency. Changes in the peak intensity were reversible with SAW-on and SAW-off. From a comparison of previous findings that the SAW caused an increase in the work function of the low index planes and a decrease in that of high index planes, the SAW-induced peak intensity changes are associated with variations in the work function. The SAW is concluded to have significant effects on the adsorbed states of CO by affecting the electronic structures of metal surfaces. (c) 2005 Elsevier B.V. All rights reserved.