Use of auger and x‐ray photoelectron spectroscopy to study the locus of failure of structural adhesive joints
Use of auger and x‐ray photoelectron spectroscopy to study the locus of failure of structural adhesive joints
复制标题
使用螺旋钻和 X 射线光电子能谱研究结构粘合接头的失效轨迹
DOI：
10.1002/app.1977.070210907
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发表时间：
1977
影响因子：
3
通讯作者：
A. Kinloch
中科院分区：
文献类型：
--
作者：
M. Gettings;F. Baker;A. Kinloch
本文用俄歇电子能谱（AES）和X射线光电子能谱（XPS）技术研究了环氧树脂接头的破坏部位。还研究了长时间水浸和硅烷基底漆的应用的影响。结果表明，干燥接头断裂发生在环氧树脂/金属界面附近，而浸水未涂底漆的接头，断裂发生在粘合剂和氧化铁之间的界面处。在粘合之前将底漆施加到金属表面防止了水形成的氧化物的形成，尽管随后发现通过底漆发生断裂。
The techniques of Auger electron spectroscopy (AES) and x-ray photoelectron spectroscopy (XPS) have been used to study the locus of failure of epoxy resin joints. The effects of a long water immersion and the application of a silane-based primer have also been studied. Results indicated that for dry joints fracture occurred near an epoxy resin/metal interface while with water-soaked unprimed joints, fracture occurred interfacially between the adhesive and iron oxide. The application of the primer to the metal surface prior to bonding prevented the formation of a water-formed oxide although fracture was then found to occur through the primer.