Effects of additives on copper electrodeposition in submicrometer trenches
Effects of additives on copper electrodeposition in submicrometer trenches
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DOI：
10.1149/1.1867672
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发表时间：
2005-01-01
影响因子：
3.9
通讯作者：
Osaka, T
中科院分区：
文献类型：
--
作者：
Hasegawa, M;Negishi, Y;Osaka, T
采用电化学极化曲线和截面显微镜研究了电解液中常用添加剂[Cl-、聚乙二醇（PEG）、二硫化二（3-磺丙基）二硫化物（SPS）和Janus绿色B（JGB）]对铜填充亚微米沟槽的影响。Cl-和PEG的组合抑制铜沉积在该地区的开口的沟槽，而SPS加速它在底部。极化曲线表明，SPS对铜沉积的加速程度随SPS浓度的增加而增加。这种SPS浓度依赖的加速解释了观察到的自下而上的生长。JGB的加入抑制了铜沉积在填充过程的后期阶段，导致抑制了过填充现象，尽管在高JGB浓度下自下而上的生长也被抑制。浴槽搅拌显著增强了JGB对过满现象的抑制作用，而不干扰自下而上的生长。(c)2005年电化学学会。All rights reserved.
Effects of the conventional bath additives [chloride ions (Cl-), poly(ethylene glycol) (PEG), bis(3-sulfopropyl)disulfide(SPS), and Janus green B (JGB)] used in the damascene process on the filling of submicrometer trenches with electrodeposited copper were investigated by electrochemical polarization measurement and cross-sectional microscopy. The combination of Cl- and PEG inhibited copper deposition in the areas of opening of the trenches, while SPS accelerated it at the bottom. Polarization curves showed that the degree of acceleration of copper deposition by SPS increases with the concentration of SPS. This SPS concentration- dependent acceleration accounts for the observed bottom- up growth. The addition of JGB inhibited copper deposition at the later stages of the filling process, leading to the suppression of the overfill phenomenon, although the bottom-up growth was also inhibited at high JGB concentrations. Bath agitation significantly enhanced the inhibition effect of JGB on the overfill phenomenon, without disturbing the bottom-up growth. (c) 2005 The Electrochemical Society. All rights reserved.