Routes towards manufacturing biodegradable electronics with polycaprolactone (PCL) via direct light writing and electroless plating
Routes towards manufacturing biodegradable electronics with polycaprolactone (PCL) via direct light writing and electroless plating
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DOI：
10.1088/2058-8585/ac6b6e
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发表时间：
2022-06-01
影响因子：
3.1
通讯作者：
Marques-Hueso, Jose
中科院分区：
文献类型：
--
作者：
Abdulrhman, Mansour;Zhakeyev, Adilet;Marques-Hueso, Jose
电子工业在生产过程（通常是能源密集和污染）和废物管理方面采用更清洁战略方面还有改进的余地。许多像安全标签这样的小部件通常是通过一般废物处理的，采用可生物降解的聚合物可以减少这种废物。本文提出了一种在聚己内酯（PCL）上选择性沉积金属微迹的方法。这种聚合物可生物降解，柔韧，适合3D打印，并且可以从可持续来源获得。Ag离子的光还原用于产生随后选择性化学镀铜（Cu）的种子，该过程避免了常见但不需要的化合物，如氰化物和钯。两种不同的光刻方法成功地实现了选择性镀铜：使用460 nm发光二极管（LED）进行泛洪曝光，使用405 nm激光进行直接激光写入（DLW），获得了47 +/- 11 μ m宽的磁道。在PCL衬底上沉积均匀的Cu层，厚度可达14 μ m，电导率可达2.06 × 10(7) S m(-1)，接近大块Cu的电导率(5.89 × 10（7) S m(-1)）。镀铜互连被证明是完全功能供电5 SMD led电路。此外，DLW可以在不均匀的衬底上制造互连。这种方法具有灵活性、选择性、低成本、无真空和对环境影响最小的特点，为制造可生物降解的电子产品提供了一条新的途径。
The electronic industry has room for improvement in adopting cleaner strategies, both in production processes (often energy-intensive and polluting) and in waste management. Many small components like security tags are routinely disposed of via general waste, which could be reduced adopting biodegradable polymers. In this work, a method for selective deposition of metallic micro-tracks on polycaprolactone (PCL) for circuitry integration is presented. The polymer is biodegradable, flexible, suitable for 3D printing, and can be obtained from sustainable sources. Photoreduction of Ag ions was used to generate seeds for subsequent selective electroless copper (Cu) plating in a process that avoids common but undesirable compounds such as cyanides and palladium. Two different photopatterning methods were successfully used to achieve selective Cu plating: flood exposure with a 460 nm light-emitting diode (LED) and direct laser writing (DLW) using a 405 nm laser, achieving 47 +/- 11 mu m wide tracks. The deposition of uniform Cu layers on PCL substrates is demonstrated, with thicknesses of up to 14 mu m and electrical conductivities of up to 2.06 x 10(7) S m(-1), which is near the conductivity of bulk Cu (5.89 x 10(7) S m(-1)). Cu-plated interconnects were demonstrated to be fully functional for powering a 5 SMD LEDs circuit. Furthermore, DLW enabled the interconnect manufacturing on an uneven substrate. This method is flexible, selective, low-cost, vacuum-free and of minimized environmental impact, and it provides a new route towards the manufacturing of biodegradable electronics.