The first back-side illuminated types of Kyoto's X-ray astronomy SOIPIX
The first back-side illuminated types of Kyoto's X-ray astronomy SOIPIX
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京都第一批背照式 X 射线天文学 SOIPIX
DOI：
10.1016/j.nima.2016.04.012
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
K. Tamasawa and C. Tindall
中科院分区：
文献类型：
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作者：
M. Itou;T. G. Tsuru;T. Tanaka;A. Takeda;H. Matsumura;S. Ohmura;H. Uchida;S. Nakashima;Y. Arai;I. Kurachi;K. Mori;R. Takenaka;Y. Nishioka;T. Kohmura;K. Tamasawa and C. Tindall
我们一直在开发京都的X射线天文学SOI像素传感器，称为“XRPIX”，旨在通过0.5-40 keV波段的宽带成像光谱学扩展X射线天文学的前沿。X射线入射表面上的死层理想地应当尽可能薄以实现低于1 keV的高灵敏度，并且耗尽层需要足够厚以检测40 keV的X射线。因此，我们已经开始开发完全耗尽的背面照明（BI）类型的XRPIX。本文报告了我们的前两个BI设备及其X射线评价（2.6-12 keV）。命名为“XRPIX 2b-FZ-LA”的器件成功地达到了500 μm厚度的完全耗尽。另一方面，它具有厚度为1.1-1.5 μm的死层，并且难以达到1.0 μm的要求。另一种称为“XRPIX 2b-CZ-PZ”的器件采用了薄硅传感层和改进的背面工艺，其厚度为0.9-1.0 μm，包括0.2 μm的Al光学阻挡滤波器，可以满足要求，尽管硅传感层相当薄，为62 μm。我们还描述了在本文中的X射线校准系统，我们已经建立了X射线评价的XRPIXs。
We have been developing Kyoto's X-ray astronomy SOI pixel sensors, called “XRPIX”, aiming to extend the frontiers of X-ray astronomy with the wide-band imaging spectroscopy in the 0.5–40 keV band. A dead layer on the X-ray incident surface should ideally be as thin as possible to achieve a high sensitivity below 1 keV, and the depletion layer is required to be thick enough to detect 40 keV X-rays. Thus, we have started developing fully-depleted back-side illuminated (BI) types of XRPIXs. This paper reports on our first two BI devices and their X-ray evaluation (2.6–12 keV). The device named “XRPIX2b-FZ-LA” successfully reaches a full depletion with a thickness of 500 μm. On the other hand, it has a dead layer with a thickness of 1.1–1.5 μm and struggles to achieve the requirement of 1.0 μm. The other device named “XRPIX2b-CZ-PZ”, which is applied with a thin Si sensor-layer and an improved back-side process, is found to satisfy the requirement with its thickness of 0.9–1.0 μm, including Al optical blocking filter of 0.2 μm, although the Si sensor-layer is rather thin with 62 μm. We also describe in this paper the X-ray calibration system that we have built for the X-ray evaluation of XRPIXs.