Effective thermal via and decoupling capacitor insertion for 3D system-on-package
Effective thermal via and decoupling capacitor insertion for 3D system-on-package
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DOI：
10.1109/ectc.2006.1645903
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发表时间：
2006-07
期刊：
影响因子：
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通讯作者：
E. Wong;J. Minz;S. Lim
中科院分区：
文献类型：
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作者：
E. Wong;J. Minz;S. Lim
3D系统级封装（SOP）的组件密度增加加剧了热热点问题。热通孔（t-vias）是缓解散热问题的常用选择，用于建立从SOP封装核心到散热器的热路径。SOP集成的另一个主要问题是构成系统的各种混合信号组件之间的电源噪声耦合。在这种情况下，插入去耦电容器（decaps）以在本地提供开关电流。我们的自动3D SOP元件放置算法的目标是确定每个元件的x/y/z位置，同时在热和电源噪声约束下最小化封装面积。一般来说，t型通孔和开盖通常插入布局中的白色空间中，而t型通孔和开盖与目标组件的接近度决定了它们的有效性。因此，我们的元件放置器在早期设计阶段考虑T通孔和开盖插入，其中元件位置可以灵活地改变。相关实验证明了该方法的有效性
The increased component density of a 3D system-on-package (SOP) exacerbates the thermal hotspot problem. A popular choice to mitigate the thermal issues is thermal vias (t-vias) that are used to establish thermal paths from the core of an SOP package to the heat sinks. Another major problem with SOP integration is the power supply noise coupling among various mixed signal components constituting the system. In this case, decoupling capacitors (decaps) are inserted to provide the switching currents locally. The goal of our automatic 3D SOP component placement algorithm is to determine the x/y/z location of each component while minimizing the footprint area under thermal and power supply noise constraints. In general, t-vias and decaps are typically inserted in the white space in the placement, whereas the proximity of the t-vias and decaps to the target components determines their effectiveness. Hence, our component placer considers t-via and decap insertion during the early design stage, where the component location can be flexibly changed. Related experiments demonstrate the effectiveness of our approach