New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures
New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures
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DOI：
10.1088/0960-1317/8/3/003
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发表时间：
1998-09-01
影响因子：
2.3
通讯作者：
Stemme, G
中科院分区：
文献类型：
--
作者：
Ebefors, T;Kalvesten, E;Stemme, G
一种新颖而简单的技术已被开发和研究，用于制造具有小弯曲半径的坚固三维 (3D) 硅结构。所提出的将 3D 结构弯曲到平面外的自组装方法，使其在没有任何互锁支架的情况下保持弯曲，该方法基于 V 形槽中聚酰亚胺的热收缩。通过改变聚酰亚胺的固化温度，可以选择用于永久面外旋转结构的大范围的弯曲角度。聚酰亚胺相对较大的热膨胀使得可以在动态模式下使用该结构，以补偿不期望的工艺变化。所提出的技术与基于 IC 的表面微加工和批量制造兼容。因此，基于新型聚酰亚胺接头的结构在微机械加工中具有普遍应用，可用于许多在所有三个维度上都具有详细特征的新型3D传感器或执行器。对于测试的聚酰亚胺V形槽接头，已经实现了0度至200度之间的静态弯曲角度，每个V形槽的最大弯曲角度为35度。已测量出30μm厚的面外旋转硅板的弯曲半径小于60μm。已对组装结构的电气连接进行了研究。事实证明，穿过聚酰亚胺接头中 V 形槽的铝导体不会受到面外旋转的影响。
A novel and simple technology for making robust three-dimensional (3D) silicon structures with small radii of bending has been developed and investigated. The proposed self-assembly method of bending 3D structures out of plane such that they stay bent without any interlocking braces is based on thermal shrinkage of polyimide in V-grooves. A wide range of bending angles for the permanent out-of-plane rotated structure can be chosen by varying the curing temperature of the polyimide. The relatively large thermal expansion of polyimide makes it possible to use the structure in a dynamic mode useful for compensation of undesired process variations. The proposed technique is compatible with both IC based surface micromachining and batch fabrication. Therefore, structures based on the new polyimide joint have general applications in micromachining and can be used in many new 3D sensors or actuators having detailed features in all three dimensions.For the tested polyimide V-groove joints, static bending angles between 0 degrees and 200 degrees have been achieved with a maximum bending angle of 35 degrees per V-groove. Bending radii smaller than 60 mu m for a 30 mu m thick out-of-plane rotated silicon plate have been measured. Electrical connections to the assembled structures have been investigated. It has been shown that the aluminium conductors crossing the V-grooves in the polyimide joint are not affected by the out-of-plane rotation.