Evaluation and optimisation of the SSAIL method for laser-assisted selective electroless on dielectrics
Evaluation and optimisation of the SSAIL method for laser-assisted selective electroless on dielectrics
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DOI：
10.1016/j.rinp.2020.102943
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发表时间：
2020-03-01
影响因子：
5.3
通讯作者：
Raciukaitis, Gediminas
中科院分区：
文献类型：
--
作者：
Ratautas, Karolis;Jagminien, Aldona;Raciukaitis, Gediminas
三维微细集成器件(3D-MID)中电路线的形成是3D-MID面临的最大挑战之一。我们开发了一种名为“激光诱导的选择性表面活化”(SSAIL)的新方法，这是一种很有前途的技术，可以解决聚合物上出现的电导体生产问题。SSAIL包括3个主要步骤：介质表面的激光改性、改性区的化学活化和活化件的化学镀。在这篇文章中，提供了通过评估最终的金属镀痕的性能来优化SSAIL工艺的路线和结果。提出了一种基于电镀质量和可靠性的特殊工艺验证方法。通过方块电阻、与基材的结合力和镀铜的空间选择性来确定最佳的激光加工参数。
Formation of electrical circuit traces on 3D shaped dielectrics is one of the biggest challenges in 3D Microscopic Integrated Devices (3D-MID). We have developed a new method called "Selective Surface Activation Induced by a Laser" (SSAIL), which is a promising technology for solving emerged production issues for electrical conductors on polymers. SSAIL contains 3 main steps: laser modification of the dielectric surface, chemical activation of the modified areas and electroless plating of the activated parts. In this paper, the route and results on optimisation of the SSAIL process by evaluating properties of the final metal-plated traces are provided. A special validation method of the technology based on the quality and reliability of the plating has been proposed. The sheet resistance, adhesion strength to the substrate and spatial selectivity of plated copper were used to find the optimal laser processing parameters.