Resonant inductive decoupling (RID) for transceiver arrays to compensate for both reactive and resistive components of the mutual impedance.
Resonant inductive decoupling (RID) for transceiver arrays to compensate for both reactive and resistive components of the mutual impedance.
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DOI：
10.1002/nbm.2989
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发表时间：
2013-11
影响因子：
2.9
通讯作者：
Hetherington, Hoby P.
中科院分区：
文献类型：
--
作者：
Avdievich, Nikolai I.;Pan, Jullie W.;Hetherington, Hoby P.
Transceiver surface coil arrays improve transmit performance (B1/√kW) and B1 homogeneity for head imaging up to 9.4 T. To further improve reception performance and parallel imaging the number of array elements has to be increased with correspondent decrease of their size. With a large number of small interacting antennas decoupling is one of the most challenging aspects in the design and construction of transceiver arrays. Previously described decoupling techniques using geometric overlap, inductive or capacitive decoupling have focused on eliminating only the reactance of the mutual impedance, which can limit the obtainable decoupling to −10 dB due to residual mutual resistance. A novel resonant inductive decoupling (RID) method, which allows compensation for both reactive and resistive components of the mutual impedance between the adjacent surface coils, has been developed and experimentally verified. This method provides an easy way to adjust the decoupling remotely by changing the resonance frequency of the RID circuit through adjustment of a variable capacitor. As an example a single row (1×16) 7T transceiver head array of n=16 small overlapped surface coils using RID decoupling between adjacent coils was built. In combination with overlapped coils the RID technique achieved better than −24 dB of decoupling for all adjacent coils.
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影响因子：
4.4
作者：
Ibrahim, Tamer S.;Tang, Lin
通讯作者：
Tang, Lin
DOI：
10.1002/cmr.b.20078
发表时间：
2007-02-01
影响因子：
0.9
作者：
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通讯作者：
Vigneron, Daniel B.
影响因子：
3.3
作者：
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通讯作者：
Ugurbil, K
影响因子：
3.3
作者：
Mao, Weihua;Smith, Michael B.;Collins, Christopher M.
通讯作者：
Collins, Christopher M.
影响因子：
3.3
作者：
Katscher, U;Börnert, P;van den Brink, JS
通讯作者：
van den Brink, JS