Thermal Composites of Biobased Polyamide with Boron Nitride Micro Networks
Thermal Composites of Biobased Polyamide with Boron Nitride Micro Networks
复制标题
DOI：
10.1007/s10924-015-0733-8
复制
发表时间：
2015-12-01
影响因子：
5.3
通讯作者：
Naguib, Hani E.
中科院分区：
文献类型：
--
作者：
Mosanenzadeh, Shahriar Ghaffari;Liu, Min Wen;Naguib, Hani E.
随着人们对环境造成的损害的认识不断增强，以及减少和抵消这种损害的几乎无处不在的冲动，可再生（绿色）资源的使用变得越来越受欢迎。电子工业每天继续生产数百万个电子设备，现代技术的快速发展缩短了这些设备的使用寿命。因此，寻找回收这些设备的解决方案变得越来越迫切。此外，由于电子设备不断变得更小、更强大，累积的热量集中进一步降低了效率。因此，散热在现代电子封装应用中起着非常重要的作用。生物基高导热聚合物复合材料似乎有可能成为当前电子封装的合适替代品。这些复合材料有望改善电子产品的热管理，并防止环境中不可回收的油基产品。在本研究中，对部分生物基聚酰胺（PA）与微米级六方氮化硼（hBN）片状复合材料进行了参数研究。对具有高导热六方氮化硼的复合材料中的高粘度 PA90 和低粘度 PA30 进行比较，以确定基体粘度对六方氮化硼颗粒的流动性和排列以及复合材料的有效导热率的影响。低粘度 PA30 始终保持比 PA90 更高的导热率值。然而 PA90 显示出更高的机械性能。此外，通过缩小样品的填料含量差异，观察到填料含量和复合材料的有效导热率之间有趣的非线性趋势。
With the growing awareness of the damage sustained by environment, and the nearly-ubiquitous impulse to minimize and counteract this damage, the use of renewable (green) resources is becoming increasingly popular. Electronic industry continues to produce millions of electronic devices daily and the rapid growth of modern technology reduces these devices' useable life spans. As a result, it has become increasingly imperative to find solutions for recycling these devices. Furthermore, since electronic devices are constantly becoming smaller and more powerful, accumulating heat concentration further reduces efficiency. Therefore, heat dissipation plays a very important role in modern electronic packaging applications. Bio-based high thermally conductive Polymeric composites seem to be potentially suitable replacements for current electronic packaging. These composites promise improved thermal management of electronics as well as protection from non-recyclable oil-based products in the environment. In this research, parametric study on partially bio-based polyamide (PA) in composite with micron size hexagonal boron nitride (hBN) platelets were performed. High viscosity PA90 and low viscosity PA30, both in composites with high thermally conductive hBN, were compared to determine the effect of matrix viscosity on mobility and arrangement of hBN particles, as well as effective thermal conductivity of the composite. Low viscosity PA30 consistently maintained higher values of thermal conductivity than the PA90. However PA90 shows higher mechanical properties. Furthermore, by narrowing down the filler content difference of the sample an interesting nonlinear trend between filler content and effective thermal conductivity of the composite is observed.