NCF for pre-applied process in higher density electronic package including 3D-package
NCF for pre-applied process in higher density electronic package including 3D-package
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NCF 用于更高密度电子封装（包括 3D 封装）中的预涂工艺
DOI：
10.1109/ectc.2012.6248859
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
H. Abe
中科院分区：
文献类型：
--
作者：
K. Honda;A. Nagai;M. Satou;S. Hagiwara;S. Tuchida;H. Abe
针对包括3D封装在内的更高密度电子封装，我们开发了一种新型的NCF（非导电膜）支持，用于同时连接和底部填充芯片的预应用工艺。我们对基膜、填料尺寸等进行了改性，并提高了层压和BG（背面研磨）能力、透明度和切割能力，以获得优异的粘合前加工性能。我们还优化了NCF的粘度，并在NCF中添加了非常有效的助熔剂（有机酸）以改善其粘结性。这些性能使得可以在短时间内（<5 s）形成优异的Cu-焊料结合部件而没有空隙。对于可靠性，我们发现了适当的助熔剂（有机酸），其可以显著抑制吸湿处理后的粘合强度降低到足以通过模制PKG的Lv 2/回流测试的程度。我们还评估了使用该NCF的伪3D封装的可加工性和可靠性，并获得了在成型PKG后维持芯片堆叠并通过Lv 2/回流测试的能力的结果。从这些特点来看，这种新型的NCF有望成为一种有前途的TSV（硅通孔）3D封装材料。
For higher density electronic package including 3D-package, we developed a novel NCF (Non Conductive Film) support for the pre-applied process that connects and underfills a chip simultaneously. We modified the base film, filler size and others and improved the ability in lamination and BG (back grinding), transparency and dicing to get the excellent processability before the bonding. We also optimized the viscosity and added the remarkably effective flux agent (organic acid) into the NCF to improve the bondability. These properties made it possible to form the excellent Cu-solder bonding parts in short time (<;5 s) without void. For the reliability, we discovered the adequate flux agent (organic acid) which considerably can suppress the decreasing of the adhesive strength after moisture absorption treatment to the extent enough to pass the Lv2/reflow test of molded PKG. We also evaluated the processability and reliability of the pseudo 3D package using this NCF, and obtained the result of the ability to sustain the chip stack and pass the Lv2/reflow test after molding PKG. From these features, this novel NCF is expected to be a promising material for the 3D package with TSV (Through Silicon Via).