An optoelectronic sensor for cure monitoring in thermoset-based composites
An optoelectronic sensor for cure monitoring in thermoset-based composites
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DOI：
10.1016/s0924-4247(00)00361-7
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发表时间：
2000-09-01
影响因子：
4.6
通讯作者：
Nicolais, L
中科院分区：
文献类型：
--
作者：
Cusano, A;Breglio, G;Nicolais, L
在本文中，我们介绍了一种光电光纤传感器的设计和实验结果，该传感器能够监测热固性聚合物基复合材料加工的聚合反应。由于其低成本/轻重量的特点，此类材料现已广泛应用于航空、航天、汽车和民用等大型工业领域。不幸的是，它们的最终特性很大程度上取决于加工阶段。为了确保设置正确的工艺参数（即温度和压力），在反应过程中监控固化度 (DOC) 和粘度等工艺变量至关重要。在这项工作中，我们指出了我们对使用光纤传感器的关注，该传感器可以嵌入复合材料部件中，以监测固化过程中发生的交联形成。基于菲涅尔折射原理，所提出的传感器方案对折射率变化敏感。实验结果显示了传感器监测固化动力学的能力，并提出了一种新颖的校准方法，以便将光电响应直接与反应树脂的 DOC 联系起来。 (C) 2000 Elsevier Science S.A. 保留所有权利。
In this paper, we present the design and the experimental results of an optoelectronic fiber optic sensor able to monitor the polymerization reactions of thermoset polymer-matrix composite processing. These kinds of materials are now widely used in large industrial areas: aeronautical, aerospace, automotive and civil due to their low cost/low weight features. Unfortunately, their final properties are strongly dependent on the processing stage. In order to ensure the setting of correct processing parameters (i.e. temperature and pressure), it is crucial to monitor, during the reaction, the process variables such as degree of cure (DOC) and viscosity. In this work, we point out our attention upon the use of a fiber optic sensor, which can be embedded into the composite component, to monitor the cross-linking formation, occurring during the curing process. Based on the Fresnel refraction principles, the proposed sensor scheme is sensitive to refractive index variation. Experimental results are shown on sensor capability to monitor the cure kinetics, and a novel calibration method is proposed in order to link the optoelectronic response directly to the DOC of the reacting resin. (C) 2000 Elsevier Science S.A. All rights reserved.