Micro-hybrid system in polymer foil based on adaptive layout
Micro-hybrid system in polymer foil based on adaptive layout
复制标题
基于自适应布局的聚合物箔微混合系统
DOI：
10.1109/estc.2016.7764465
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
Joachim N. Burghartz
中科院分区：
文献类型：
--
作者：
Golzar Alavi;Holger Sailer;H. Richter;B. Albrecht;Muhammad Alshahed;C. Harendt;Joachim N. Burghartz
箔中微混合系统 (HySiF) 涉及在聚合物箔中嵌入和互连的超薄芯片，适用于各种柔性电子应用。本文介绍了聚合物中超薄芯片的晶圆级嵌入和互连的概念和结果。所提出的 HySiF 的显着成就是基于自适应互连布局的晶圆级一对功能芯片之间的精确互连，从而允许芯片内外的导线间距较小。因此，可以从芯片上放弃接触焊盘，从而减少硅面积，从而降低成本。此外，嵌入式芯片的错位可以通过自适应布局进行补偿，从而允许更高的 I/O 数量。在本文中，这种新颖的嵌入技术通过小于 108 μm 的金属间距和一对间距在 200-1000 μm 范围内的功能芯片进行了演示。
The micro-hybrid system in foil (HySiF) involves ultra-thin chips embedded and interconnected in polymer foil for diverse flexible electronic applications. In this paper, the concepts and results of wafer level embedding and interconnection of ultra-thin dies in polymers are presented. The significant achievement of the presented HySiF is the accurate interconnection between a pair of functional chips at wafer level based on an adaptive interconnect layout, thus allowing for a small wire pitch on and off the chip. As a result, contact pads can be abandoned from the chip, which leads to reduced silicon area and, thus, lower cost. In addition, misalignment of embedded chips can be compensated by the adaptive layout, thus allowing for far higher I/O count. In this paper, this novel embedding technique is demonstrated with a metal pitch less than 108 μm and for a pair of functional chips spaced in the range of 200-1000 μm.