Wire bond degradation under thermo- and pure mechanical loading
Wire bond degradation under thermo- and pure mechanical loading
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DOI：
10.1016/j.microrel.2017.07.055
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发表时间：
2017-09-01
影响因子：
1.6
通讯作者：
Pedersen, Kjeld
中科院分区：
文献类型：
--
作者：
Pedersen, Kristian Bonderup;Nielsen, Dennis A.;Pedersen, Kjeld
本文介绍了一个基本的研究退化的重型铝键合线通常用于大功率模块。定制样品设计为仅由标准Si二极管上的Al键合线组成。这些样品进行纯机械和被动热循环，以研究在一个简单的系统，以及比较这两种测试方法的债券退化行为。尽管在这两种方法之间观察到断裂行为的明显差异，但两者都提供了循环次数与降解程度之间的相关性，特别是在被动热测试的情况下。为了使调查的退化率大量的债券接口进行了分析，他们发现遵循传统的接受断裂规律，如巴黎-埃尔多安。通过额外的工作，这可以使获得经验参数的可能性被用于实际的物理寿命定律。(C)2017爱思唯尔有限公司版权所有
This paper presents a fundamental study on degradation of heavy Al bond wires typically used in high power modules. Customized samples are designed to only consist of Al bond wires on standard Si diodes. These samples are subjected to pure mechanical and passive thermal cycling to investigate the bond degradation behavior on a simple system as well as compare these two test methods. Although an appreciable difference in fracture behavior is observed between these two methods, both provide correlation between the number of cycles and degree of degradation, especially in the case of the passive thermal test. To enable investigation of degradation rate a large number of bond interfaces is analyzed and they are found to follow conventional accepted fracture laws like Paris-Erdogan. With additional work this could enable the possibility of obtaining empirical parameters to be used in actual physics based lifetime laws. (C) 2017 Elsevier Ltd. All rights reserved.