Influence of the compositional profile of functionally graded material on the crack path under thermal shock
Influence of the compositional profile of functionally graded material on the crack path under thermal shock
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DOI：
10.1111/j.1151-2916.2001.tb00864.x
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发表时间：
2001-07-01
影响因子：
3.9
通讯作者：
Noda, N
中科院分区：
文献类型：
--
作者：
Fujimoto, T;Noda, N
讨论了陶瓷/金属功能梯度板瞬态温度场下的热裂纹当功能梯度板从高温冷却时，陶瓷表面经常出现弯曲或直的裂纹路径。结果表明，裂纹路径受到功能梯度板的成分分布的影响。瞬态热应力被视为平面应变状态的线性准静态热弹性问题。裂纹路径是使用有限元方法通过模式 I 和模式 II 应力强度因子获得的。
Thermal cracking under a transient-temperature field in a ceramic/metal functionally graded plate is discussed When the functionally graded plate is cooled from high-temperature, curved or straight crack paths often occur on the ceramic surface. It is shown that the crack paths are influenced by the compositional profile of the functionally graded plate. Transient-thermal stresses are treated as a linear quasi-static thermoelastic problem for a plane strain state. The crack paths are obtained using finite element method with Mode I and Mode II stress intensity factors.