Effect of Additives on the Process of Manufacturing Copper Foil for Printed Circuit Boards.
Effect of Additives on the Process of Manufacturing Copper Foil for Printed Circuit Boards.
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添加剂对印刷电路板铜箔制造工艺的影响。
DOI：
10.4139/sfj.44.1119
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发表时间：
1993
期刊：
影响因子：
--
通讯作者：
E. Sato
中科院分区：
文献类型：
--
作者：
Shuuji Iimura;S. Maeda;S. Yoshihara;E. Sato
为了生产印刷电路板用铜箔，研究了各种添加剂对电沉积铜箔的影响。在铜沉积的初始过程中，利用光声光谱(PAS)可以精确地评价明胶的作用机理。在极低的硫脲浓度下，铜镀层的表面形貌为树枝状，没有硫脲络合物的降解。这些添加剂的存在也导致了铜镀层呈现出(111)择优取向，这对印刷电路板用铜箔具有良好的刻蚀性能。
The effect of various additives on the electrodeposition of copper foil was investigated in order to produce copper foil for use on printed circuit boards. In the initial process of copper deposition, it was possible to evaluate the action mechanism of gelatin precisely using photoacoustic spectroscopy (PAS). At extremely low thiourea concentrations, the surface morphology of the copper deposits showed dendrites unaccompanied by degradation of thiourea complex. The presence of these additives also resulted in the copper deposits showing a (111) preferential orientation, which has excellent etching characteristics for copper foil for use on printed circuit boards.