Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction

Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
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从空穴能量的角度检查负偏压温度应力引起的退化机制,以准确预测寿命

DOI:
10.1016/j.microrel.2006.06.001
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发表时间:
2007
期刊:
Microelectron. Reliab.
影响因子:
--
通讯作者:
T. Ohmi
T. Ohmi
中科院分区:
--
文献类型:
--
作者:
Kazufumi Watanabe;A. Teramoto;R. Kuroda;S. Sugawa;T. Ohmi

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