Wetting transition behavior of Ag–Cu alloy braze on BaCo0.7Fe0.2Nb0.1O3-δ ceramic
Wetting transition behavior of Ag–Cu alloy braze on BaCo0.7Fe0.2Nb0.1O3-δ ceramic
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BaCo0.7Fe0.2Nb0.1O3-δ陶瓷上Ag-Cu合金钎料的润湿转变行为
DOI：
10.1016/j.ceramint.2021.02.022
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发表时间：
2021-05
影响因子：
5.2
通讯作者：
Xionggang Lu
中科院分区：
文献类型：
--
作者：
Chao Zhang;Jinjin Lv;Dan Bai;Lanqian Li;Ting Liu;Yuwen Zhang;Xionggang Lu
为实现BaCo0.7Fe0.2Nb0.1O3-δ（BCFN）陶瓷透氧膜与金属支撑体之间的可靠密封，研究了不同铜含量的Ag-Cu钎料在980 °C空气中对BCFN陶瓷的润湿转变行为。随着Ag-Cu合金中Cu含量的增加，润湿状态呈现出非润湿→润湿→润湿的复杂过渡规律，且有一个脊。脊的形成导致宏观和微观接触角的不一致。TEM-EDS表征证实，在钎焊过程中，在液体钎焊料中的Cu-O和BCFN基体之间发生交换反应（Cu 2 + ParticCo 2+）。随着Cu含量的增加，固/液/气三相线处界面产物的增多，增强了Ag-Cu钎料铺展的钉扎效应和毛细效应，导致润湿状态的转变。BCFN衬底的密度越低，对应于越高的润湿转变临界铜含量。这是由于钎料中的Cu-O与BCFN基体沿着气孔快速反应，而在结合界面生成的产物较少，削弱了对Ag-Cu钎料铺展的阻碍作用。控制界面产物在连接界面处的堆积，避免脊的形成，是提高膜组件密封质量的关键。
To achieve reliable sealing between the BaCo0.7Fe0.2Nb0.1O3-δ(BCFN) ceramic oxygen permeable membrane and its metal support, the wetting transition behavior of Ag–Cu braze with different copper content on BCFN ceramic at 980 °C in air were revealed. As the copper content in Ag–Cu alloy increased, the wetting status showed a complex transition law of non-wetting → wetting → wetting with a ridge. The formation of ridges led to the inconsistency of the macroscopic and the microscopic contacting angles. TEM-EDS characterization confirmed that an exchange reaction (Cu2+↔Co2+) occurred between the Cu–O in the liquid braze and the BCFN substrate during the brazing process. With the increase of copper content, the increasing amount of interfacial products formed at the solid/liquid/vapor triple line enhanced the pinning effect and capillary effect on the spreading of the Ag–Cu braze, resulting in the transition of wetting status. The lower density of BCFN substrate corresponded to the higher critical copper content for wetting transition. The reason is that the Cu–O in the alloy braze reacted with the BCFN substrate rapidly along the pores, while the products at the joining interface were less, which weakened the hindering effect on the spreading of the Ag–Cu braze. Controlling the accumulation of interfacial products at the joining interface to avoid the formation of ridges is the key to improve the sealing quality of membrane components.
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DOI：
10.4028/www.scientific.net/kem.122-124.305
发表时间：
1996-09
期刊：
Key Engineering Materials
影响因子：
--
作者：
I. Nettleship
通讯作者：
I. Nettleship
DOI：
10.1361/1054971023604161
发表时间：
2002-04
期刊：
Journal of Phase Equilibria
影响因子：
--
作者：
L. Zabdyr;O. Fabrichnaya
通讯作者：
L. Zabdyr;O. Fabrichnaya
影响因子：
5.2
作者：
Yuwen Zhang;Z. Lili;Wei Guo;Tingwei Liu;Chengzhang Wu;W. Ding;Xionggang Lu
通讯作者：
Yuwen Zhang;Z. Lili;Wei Guo;Tingwei Liu;Chengzhang Wu;W. Ding;Xionggang Lu
影响因子：
9.4
作者：
Saiz, E;Cannon, RM;Tomsia, AP
通讯作者：
Tomsia, AP
影响因子：
8.8
作者：
Yuwen Zhang;Yong Liu;Cheng Wang;Zhibin Yang;W. Ding;Xionggang Lu
通讯作者：
Yuwen Zhang;Yong Liu;Cheng Wang;Zhibin Yang;W. Ding;Xionggang Lu