An Ultra-Thin Hermetic Package Utilizing Electroplated Gold
An Ultra-Thin Hermetic Package Utilizing Electroplated Gold
复制标题
采用电镀金的超薄气密封装
DOI：
10.1007/978-3-642-59497-7_45
复制
发表时间：
2001
影响因子：
4.6
通讯作者：
K. Najafi
中科院分区：
文献类型：
--
作者：
B. Stark;K. Najafi
本文报道了在晶圆级超薄密封生物相容性封装的新技术的发展和特性，并提供了证明封装密封性的数据。这项技术利用一层3微米厚的金膜，电镀在2微米厚的聚酰亚胺层上，以完全包裹可植入系统的一部分，该系统可能包含集成电子设备。该封装在可植入探针基板上实现，以展示该技术的未来应用，产率为88%。该技术的进一步特点是开发了集成盐水传感器，该传感器预测浸泡在磷酸盐缓冲盐水中的MTTF为160年。
This paper reports development and characterization of a novel technology for ultra-thin hermetic biocompatible packages at the wafer level and presents data demonstrating the hermeticity of the package. This technology utilizes a 3-micron thick film of gold that is electroplated over a 2-micron thick polyimide layer to completely enclose a section of an implantable system, which may contain integrated electronics. This package was implemented on an implantable probe substrate to demonstrate a future application of the technology, with a yield of 88%. This technology was further characterized through the development of an integrated saline sensor, which predicted a MTTF of 160 years when soaking in Phosphate Buffered Saline.