Spatial and geometrical-based characterization of microstructure and microhardness for an electron beam melted Ti-6Al-4V component
Spatial and geometrical-based characterization of microstructure and microhardness for an electron beam melted Ti-6Al-4V component
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DOI：
10.1016/j.matdes.2016.01.093
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发表时间：
2016-04-05
影响因子：
8.4
通讯作者：
Wei, Jun
中科院分区：
文献类型：
--
作者：
Wang, Pan;Tan, Xipeng;Wei, Jun
电子束熔化作为一种逐层增材制造技术，非常适用于生产具有复杂几何形状的近净形状金属零件。本文对ebm制造的基底直径为100 mm、高度为53 mm的Ti-6Al-4V叶轮进行了基于空间和几何的表征研究。叶轮最薄的部分约为0.7毫米。采用x射线计算机断层扫描、x射线衍射、光学显微镜、扫描电镜和显微硬度测试等方法对其孔隙率、显微组织和力学性能进行了研究。结果表明，在叶轮中仅检测到约0.12 vol.%的平均直径约为12 μ m的孔隙。这意味着非常高密度的部件可以由EBM技术生产。叶轮内不同部位的显微组织和显微硬度呈渐变变化，这与复杂的热梯度有关。总体而言，叶轮具有较高的显微硬度值，表明叶轮具有较高的力学性能。这些结果表明，在实际应用中，EBM是一种具有优异机械性能的复杂形状工业部件的潜在制造方法。(C) 2016 Elsevier Ltd.版权所有。
Electron beam melting (EBM), as one of the layer-by-layer additive manufacturing technologies, is very suitable for producing near net shape metallic parts with complex geometries. This paper presents a spatial and geometrical-based characterization study on an EBM-built Ti-6Al-4V impeller with a base diameter of 100 mm and a height of 53 mm. The thinnest section of the impeller is similar to 0.7 mm. The porosity, microstructure and mechanical properties were investigated by means of X-ray computed tomography, X-ray diffraction, optical microscopy, scanning electron microscopy and microhardness testing. The findings revealed that only similar to 0.12 vol.% pores with an average diameter of similar to 12 mu m were detected in the impeller. This implies that very highly dense parts could be produced by the EBM technology. Moreover, gradual changes in microstructure and microhardness at different locations in the impeller were observed, which is attributed to the complex thermal gradient. On the whole, the impeller exhibited high microhardness values, implying high mechanical properties. These results reveal that EBM is a potential method for fabricating complex-shaped industrial components with superior mechanical performance for practical applications. (C) 2016 Elsevier Ltd. All rights reserved.