Selective Laser Sintering
Selective Laser Sintering
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选择性激光烧结
DOI：
10.1002/9781119120384.ch20
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发表时间：
2019
期刊：
影响因子：
--
通讯作者：
J. Ciurana
中科院分区：
文献类型：
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作者：
J. Delgado;L. Serenó;K. Monroy;J. Ciurana
选择性激光烧结(SLS)是德克萨斯大学奥斯汀分校在20世纪80年代中期开发并获得专利的一种添加剂制造技术，用于从计算机辅助设计模型逐层生产三维物理对象。根据所使用的活动介质的物理性质，激光器通常分为四种不同的类型：固态激光器、气体激光器、半导体激光器和液体染料激光器。SLS过程可进一步分为间接SLS和直接SLS两种不同的机制或途径。在直接SLS机制中，金属或陶瓷粉末在不添加任何聚合物粘结剂的情况下进行烧结。SLS参数可以根据几何参数、激光参数或材料属性进行分类。填充间距、扫描策略和层厚度被认为是典型的几何参数。激光参数可分为扫描速度、激光功率和光束大小。激光参数还可以包括脉冲参数，例如脉冲长度和每时间单位的脉冲数。
Selective laser sintering (SLS), developed and patented at the University of Texas at Austin in the mid‐1980s, is an additive manufacturing technology used to produce three‐dimensional physical objects, layer by layer, from computer‐aided design models. Lasers are generally classified into four different types based on the physical nature of the active medium used: solid‐state lasers, gas lasers, semiconductor lasers, and liquid dye lasers. SLS process can be further divided into two different mechanisms or approaches termed indirect and direct SLS. In direct SLS mechanism, a metallic or ceramic powder is sintered without adding any polymeric binder. SLS parameters can be classifiedaccording to geometric parameters, laser parameters, or material properties. Hatch spacing, scanning strategy, and layer thickness are considered typical geometricparameters. Laser parameters can be divided into scanning speed, laser power, and beam size. Laser parameters can also include pulse parameters such as pulse length and the number of pulses pertime unit.