Fabrication and properties of SiCp/Al composites by pulsed electric current sintering
Fabrication and properties of SiCp/Al composites by pulsed electric current sintering
复制标题
DOI：
10.1007/s10853-005-1814-1
复制
发表时间：
2005-09
影响因子：
4.5
通讯作者：
M. Yang;D. M. Zhang;Xing fa Gu;L. M. Zhang
中科院分区：
文献类型：
--
作者：
M. Yang;D. M. Zhang;Xing fa Gu;L. M. Zhang
SiCp/Al composites have aroused considerable interest in many fields of industrial applications due to their tailorable mechanical properties and tailorable thermophysical properties. SiCp/Al composites have been developed mainly as structural materials application in automobile and aerospace industries. However, recent efforts have been focused on thermal management applications in electronic packaging, such as substrates, heat slugs, and heat spreads. Electronic components used in thermal management applications dissipate the heat generated by the semiconductor and reduce thermal stresses caused by the thermal expansion mismatch between electronic packaging components. If volume fractions of SiC particles as high as 70% can be achieved, it is expected that SiCp/Al composites will have thermal conductivity in excess of 130 W/m. K, and a coefficient of thermal expansion similar to those of alumina substrate or semiconductor, necessary for thermal management materials in electronic packaging applications [1–8].
