Anisotropic crack propagation behavior for the silicon‐bond coat layer in a multilayer coated system
Anisotropic crack propagation behavior for the silicon‐bond coat layer in a multilayer coated system
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多层涂层系统中硅结合涂层的各向异性裂纹扩展行为
DOI：
10.1111/ijac.13679
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发表时间：
2021
影响因子：
2.1
通讯作者：
Kakisawa Hideki
中科院分区：
文献类型：
--
作者：
Arai Yutaro;Inoue Ryo;Kakisawa Hideki
本研究旨在探讨环境阻隔涂层（EBC）系统的降解机制，热应力和裂纹扩展行为之间的关系。通过大气等离子喷涂制备由莫来石顶涂层（TC）、Si粘结涂层（BC）和SiC基底组成的EBC系统。进行热暴露测试以评估EBC系统在1300°C下持续1、10、50和100小时的微观结构。Si BC在面内（平行于各层的方向，0.4-0.6 MP）和贯穿厚度方向（从TC到基材的方向，1.7-2.1 MP）的抗断裂性不同，因为由于各层的热膨胀系数不匹配，在面内方向上诱导了热压应力，其充当裂纹扩展的屏障。然而，裂纹倾向于在面内方向上扩展，因为它们不受面内压应力的影响。这些结果清楚地表明，Si BC在热暴露后表现出面内各向异性和裂纹扩展，这是EBC系统分层的主要来源。
This study sought to examine the relationship between the degradation mechanism, thermal stress, and crack propagation behavior in environmental barrier coating (EBC) systems. An EBC system composed of a mullite topcoat (TC), Si‐bond coat (BC), and SiC substrate was prepared by atmospheric plasma spraying. Heat exposure tests were conducted to evaluate the microstructure of the EBC system at 1300°C for 1, 10, 50, and 100 h. The fracture resistance of the Si BC for the in‐plane (direction parallel to each layer, 0.4–0.6 MP) and through‐thickness directions (direction from the TC to substrate, 1.7–2.1 MP) differed because a thermal compressive stress was induced for the in‐plane direction owing to the mismatch of the thermal expansion coefficients for each layer, which acted as a barrier for crack propagation. However, cracks tended to propagate in the in‐plane direction because they were not affected by the in‐plane compressive stress. These results clearly showed that Si BC exhibited in‐plane anisotropy and crack propagation after heat exposure, which were the major sources of delamination of the EBC system.
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影响因子：
5.2
作者：
T. Miyazaki;Syo Usami;R. Inoue;Y. Kogo;Y. Arai
通讯作者：
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影响因子：
4.5
作者：
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影响因子：
3.9
作者：
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通讯作者：
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影响因子：
4.4
作者：
T. Miyazaki;Syo Usami;Y. Arai;Toru Tsunoura;R. Inoue;T. Aoki;R. Tamura;Y. Kogo
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使用脉冲激励技术测定室温和熔体温度之间的 Si 杨氏模量
DOI：
10.1002/pssc.201300101
发表时间：
2014
期刊：
Physica Status Solidi (c)
影响因子：
--
作者：
A. Swarnakar;O. Biest;J. Vanhellemont
通讯作者：
J. Vanhellemont