Image Reconstruction Under Contact Impedance Effect in Micro Electrical Impedance Tomography Sensors
Image Reconstruction Under Contact Impedance Effect in Micro Electrical Impedance Tomography Sensors
复制标题
微电阻抗层析成像传感器接触阻抗效应下的图像重建
DOI：
10.1109/tbcas.2018.2816946
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发表时间：
2018-06-01
影响因子：
5.1
通讯作者：
Takei, Masahiro
中科院分区：
文献类型：
--
作者：
Liu, Xiayi;Yao, Jiafeng;Takei, Masahiro
与传统的宏传感器相比，接触阻抗对微电阻抗断层成像（EIT）传感器具有重要影响。在目前的工作中，复接触阻抗的影响比率xi的定义，定量评估的接触阻抗的影响，通过微型EIT的重建图像的准确性。通过体模仿真，对不同xi下的重建图像质量进行了评价，找出了最佳的重建算法。广义矢量采样模式匹配（GVSPM）方法揭示了最好的图像质量和最好的容忍xi。此外，在不同的平均接触阻抗效应比下，利用GVSPM方法重建了多层微通道中酵母细胞沉积分布的图像|习|.结果表明，当测量频率f = 1 MHz，平均幅值时，图像质量最好，电压误差U-E = 0.581|习|= 26。此外，当f < 10 kHz时，细胞分布的重建图像变得不合适，|习|> 2400。
Contact impedance has an important effect on micro electrical impedance tomography (EIT) sensors compared to conventional macro sensors. In the present work, a complex contact impedance effect ratio xi is defined to quantitatively evaluate the effect of the contact impedance on the accuracy of the reconstructed images by micro EIT. Quality of the reconstructed image under various xi is estimated by the phantom simulation to find the optimum algorithm. The generalized vector sampled pattern matching (GVSPM) method reveals the best image quality and the best tolerance to xi. Moreover, the images of yeast cells sedimentary distribution in a multilayered microchannel are reconstructed by the GVSPM method under various mean magnitudes of contact impedance effect ratio |xi|. The result shows that the best image quality that has the smallest voltage error U-E = 0.581 is achieved with measurement frequency f = 1 MHz and mean magnitude |xi| = 26. In addition, the reconstructed images of cells distribution become improper while f < 10 kHz and mean value of |xi| > 2400.