Pinning Effect of In-Situ TiC p and TiB w on the Grain Size and Room Temperature Strength of (TiC + TiB)/Ti Composites
Pinning Effect of In-Situ TiC p and TiB w on the Grain Size and Room Temperature Strength of (TiC + TiB)/Ti Composites
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DOI：
10.14356/kona.2015020
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发表时间：
2015
影响因子：
4.1
通讯作者：
L. Jia;Biao Chen;Shufeng Li;H. Imai;K. Kondoh
中科院分区：
文献类型：
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作者：
L. Jia;Biao Chen;Shufeng Li;H. Imai;K. Kondoh
采用火花等离子烧结（SPS）和Ti- b4c体系热挤压法制备(TiCp + T iBw)/Ti复合材料，然后在400 ~ 800℃等温热处理24 h，研究原位成形增强材料的钉钉效果。采用SEM、XRD和TEM研究了基体的微观组织和相组成，采用EBSD分析研究了基体晶粒尺寸的变化，并测定了不同热处理后的室温强度。结果表明，与纯Ti材料相比，热处理后复合材料的Ti基体晶粒尺寸和室温强度基本保持稳定，表明原位形成的TiCp和TiBw的钉钉效应有效抑制了热处理过程中Ti基体晶粒的生长。
(TiCp + T iBw)/Ti composite was firstly prepared by spark plasma sintering (SPS) and hot extrusion from Ti-B 4C system, and then isothermally heat treated at 400–800 ° C for 24 h to study the pinning effect of the in situ formed reinforcements. Microstructure and phase composition was investigated by SEM, XRD and TEM, variation of the grain size of Ti matrix was studied by EBSD analysis, and room temperature strength was also measured after different heat treatments. Results show that, comparing with pure Ti materials, both the grain size of Ti matrix and the room temperature strength of the composite almost keep stable after heat treatments, suggesting the pinning effect of in situ formed TiCp and TiBw is effective to suppress the growth of Ti matrix grains during heat treatments.