Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold
Effects of Process Parameters on Material Removal in Vibration-Assisted Polishing of Micro-Optic Mold
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DOI：
10.3390/mi9070349
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发表时间：
2018-07-01
期刊：
影响因子：
3.4
通讯作者：
Suzuki, Hirofumi
中科院分区：
文献类型：
--
作者：
Guo, Jiang;Suzuki, Hirofumi
振动运动、磨料、压力和刀具磨损等工艺参数条件对微光学模具振动辅助抛光的材料去除效率和稳定性有重要影响。本文对工艺参数的影响进行了分析和实验研究，旨在定量地阐明影响抛光的材料去除和工艺参数之间的相互关系。研究了在不同振动运动、磨料粒度和抛光压力下表征抛光特性的材料去除率（MRR）和表面粗糙度。分析了压力和刀具磨损条件对刀具影响函数的影响。结果表明：二维振动运动产生的表面粗糙度较好，材料去除效率较高；磨料粒径越小，表面粗糙度越好，材料去除效率越低。当抛光压力超过345 kPa时，MRR随抛光压力的增加而逐渐减小，当抛光头磨损直径超过300 μ m时，MRR受抛光机磨损影响较大。
Process parameter conditions such as vibrating motion, abrasives, pressure and tool wear play an important role in vibration-assisted polishing of micro-optic molds as they strongly affect material removal efficiency and stability. This paper presents an analytical and experimental investigation on the effects of process parameters, aimed at clarifying interrelations between material removal and process parameters which affect polishing quantitatively. The material removal rate (MRR) and surface roughness which represent the polishing characteristics were examined under different vibrating motions, grain sizes of abrasives and polishing pressure. The effects of pressure and tool wear conditions on tool influence function were analyzed. The results showed that 2D vibrating motion generated better surface roughness with higher material removal efficiency while a smaller grain size of abrasives created better surface roughness but lower material removal efficiency. MRR gradually decreases with the increase of polishing pressure when it exceeds 345 kPa, and it was greatly affected by the wear of polisher when wear diameter on the polisher's head exceeds 300 mu m.