Thermal management for multifunctional structures
Thermal management for multifunctional structures
复制标题
多功能结构的热管理
DOI：
10.1109/6040.784489
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
D. Martin
中科院分区：
文献类型：
--
作者：
S. Rawal;D. Barnett;D. Martin
多功能结构(MFS)是一种创新的概念，它为航天器的设计提供了一种新的方法，消除了底盘、电缆和连接器，并将电子设备集成到航天器的墙壁中。MFS设计由粘合在结构复合板上的多层柔性电路贴片组成，执行特定功能的多芯片模块(MCM)被粘合在通过柔性电路跳线互连的电路贴片上。将高功率密度的二维(2-D)和三维(3-D)MCM整合到更小和更高效的封装设计中，仍然具有将组件温度保持在设计极限内的基本要求。更高的组件合格温度，如393K，可以产生与高效封装方案一致的较小的航天器散热器面积。在MFS开发期间，使用高导热系数(Hi-K)复合面板制造了结构散热器面板，并使用Hi-K倍增器(150-1500 W/m-K)、Hi-K(150-700 W/m-K)填充和可展开散热器的组合进行了几种热管理设计，以最大限度地提高MCM的散热效果。文中给出了热真空试验结果和热设计方法的详细内容。
Multifunctional structures (MFS) are an innovative concept that offer a new methodology for spacecraft design, eliminating chassis, cables and connectors, and integrating the electronics into the walls of the spacecraft. The MFS design consists of multilayer flexible circuit patches bonded onto a structural composite panel, and multichip modules (MCMs) performing specific functions are bonded onto the circuit patches which are interconnected via flexible circuit jumpers. Incorporation of the high power density two-dimensional (2-D) and three-dimensional (3-D) MCM's into smaller and more efficient packaging designs still has the fundamental requirement to maintain component temperatures within design limits. Higher component qualification temperatures, such as 393 K, can result in smaller spacecraft radiator areas that are consistent with efficient packaging schemes. During the MFS development effort, a structural radiator panel was fabricated using high thermal conductivity (Hi-K) composite facesheets, and several thermal management designs using combinations of Hi-K doublers (150-1500 W/m-K), Hi-K (150-700 W/m-K) corefill, and deployable radiators to maximize MCM's heat rejection. Results of the thermal vacuum tests and details of the thermal design methodology are presented in this paper.