Patterned Electroless Deposition of Copper by Microcontact Printing Palladium(II) Complexes on Titanium-Covered Surfaces
Patterned Electroless Deposition of Copper by Microcontact Printing Palladium(II) Complexes on Titanium-Covered Surfaces
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DOI：
10.1021/la991584p
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发表时间：
2000-06
期刊：
影响因子：
3.9
通讯作者：
H. Kind;Matthias Geissler;H. Schmid;B. Michel;K. Kern;E. Delamarche
中科院分区：
文献类型：
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作者：
H. Kind;Matthias Geissler;H. Schmid;B. Michel;K. Kern;E. Delamarche
利用微接触印刷(μCP)将化学试剂从弹性体印章转移到衬底的能力，直接进行化学镀铜。邮票上印有Pd(II)催化前驱体，然后将其打印到镀钛的衬底上。μCP的应用受到几个相互依赖的参数的挑战，例如印章的适当表面化学、油墨的选择、印刷过程中催化剂转移的控制、催化剂的活化以及总体上的化学镀铜。我们解决了这些问题，并提出了一种可靠的、但不是通用的方法，将微接触印刷和化学镀铜结合起来。该方法利用聚二甲基硅氧烷邮票的亲水性，并与醇溶的[(CH3−(CH2)16−CN)2PdCl2]催化前驱体墨水。将这种络合物印刷在蒸发到Si/SiO_2上的一层薄的钛层上，提供了Pd(II)络合物从印章到表面的高水平转移，同时还提供了一种新的方法。
The capability of microcontact printing (μCP) to transfer chemical reagents from an elastomeric stamp to a substrate is used here to direct electroless deposition of Cu. The stamp is inked with a Pd(II) catalytic precursor, which it prints onto a Ti-coated substrate. This application of μCP is challenged by several interdependent parameters such as the appropriate surface chemistry of the stamp, the choice of the ink, the control over the transfer of the catalyst during printing, the activation of the catalyst, and the electroless plating of Cu in general. We address these issues and suggest a reliable, but not general, method to combine microcontact printing and electroless deposition of Cu. This method uses hydrophilization of poly(dimethyl)siloxane stamps and inking with the ethanol-soluble [(CH3−(CH2)16−CN)2PdCl2] catalytic precursor. Printing this complex onto a thin Ti layer evaporated onto Si/SiO2 provides a high-level transfer of the Pd(II) complex from the stamp to the surface with simultaneous a...