High heat flux testing of tungsten plasma facing materials
High heat flux testing of tungsten plasma facing materials
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DOI：
10.1016/j.jnucmat.2007.04.006
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发表时间：
2007-08
影响因子：
3.1
通讯作者：
Zhangjian Zhou;S. Song;Juan Du;C. Ge
中科院分区：
文献类型：
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作者：
Zhangjian Zhou;S. Song;Juan Du;C. Ge
采用一种新型的超高压电阻烧结技术制备了超细晶(亚微米级)钨和功能梯度钨/铜材料。结果表明，随着钨颗粒尺寸的减小(从7μm减小到0.5μm)，钨的显微硬度和抗弯强度显著提高。通过水淬热冲击试验表明，功能梯度材料的概念对降低钨与铜之间的热应力是有效的。激光高热负荷试验表明，亚微米级的钨比1μm以上的钨具有更高的热负荷，而功能梯度钨/铜材料比纯钨具有更高的热负荷。
Both tungsten with a microstructure of ultra-fine grain size (sub-micron grain size) and functionally graded W/Cu materials have been fabricated by a newly developed technology named resistance sintering under ultra-high pressure. It is found that when decreasing the grain size of tungsten (from 7μm to 0.5μm), the micro-hardness and bend strength of tungsten will increase significantly. Thermal shock resistance by water quenching shows that the concept of functionally graded materials is effective at reducing the thermal stress between tungsten and copper. High heat flux testing using a laser beam shows that tungsten with sub-micron grain size can endure a higher heat load than that of tungsten with a grain size of larger than 1μm, and functionally graded W/Cu materials can endure a higher heat load than that of pure tungsten.