Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives
Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives
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DOI：
10.1149/1.2206008
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发表时间：
2006-01-01
影响因子：
--
通讯作者：
Osaka, Tetsuya
中科院分区：
文献类型：
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作者：
Hasegawa, Madoka;Okinaka, Yutaka;Osaka, Tetsuya
采用8-羟基-7-碘-5-喹啉磺酸（HIQSA）作为加速添加剂和聚乙二醇（PEG）作为抑制添加剂的镀液在亚微米沟槽图案化基底上进行无电铜沉积。通过添加特定浓度的HIQSA和PEG来实现沟槽的无空隙铜填充。铜沉积速率的测量结果表明，HIQSA加速沉积时，只有当它与一个非常低浓度的PEG一起添加。无空隙填充被认为是由在沟槽底部的HIQSA带来的显著加速导致的，其中PEG的浓度低。(c)2006年电化学学会。
Electroless copper deposition was performed on submicrometer-trench patterned substrates with a bath containing 8-hydroxy-7-iodo-5-quinoline sulfonic acid (HIQSA) as an accelerating additive and polyethylene glycol (PEG) as an inhibiting additive. Void-free copper filling of trenches was achieved by the addition of both HIQSA and PEG at specific concentrations. Copper deposition rate measurements revealed that HIQSA accelerated the deposition only when it was added together with a very low concentration of PEG. The void-free filling is considered to have resulted from the significant acceleration brought about by HIQSA at the trench bottom, where the concentration of PEG is low. (c) 2006 The Electrochemical Society.