ELECTROCHEMICAL STUDIES OF COPPER, COPPER-ALUMINUM AND COPPER-ALUMINUM-SILVER ALLOYS - IMPEDANCE RESULTS IN 0.5M NACL
ELECTROCHEMICAL STUDIES OF COPPER, COPPER-ALUMINUM AND COPPER-ALUMINUM-SILVER ALLOYS - IMPEDANCE RESULTS IN 0.5M NACL
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DOI：
10.1016/0013-4686(95)00108-q
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发表时间：
1995-11-01
影响因子：
6.6
通讯作者：
PROUD, WG
中科院分区：
文献类型：
--
作者：
BENEDETTI, AV;SUMODJO, PTA;PROUD, WG
用伏安法和交流阻抗谱研究了铜、铜-铝和铜-铝-银合金在0.5M、pH=3.00的氯化钠溶液中的电化学行为。用扫描电子显微镜和能谱分析对其表面进行了分析。铜-铝-银合金表现出与纯铜电极相似的动电位行为，而铜-铝合金则略有不同。在活性溶解区域，电极发生点蚀，而在其他电位区域，形成钝化膜，其组成取决于电位。讨论了电极的阻抗响应。提出了电溶解机理，并解释了合金元素对阻抗响应和极化曲线的影响。主要是由于在腐蚀界面产生了铜、银的氯化物和氧化铝/氢氧化物。Al或(Al+Ag)的加入提高了纯铜的耐蚀性。
The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, pH = 3.00) was studied by means of voltammetric methods and electrochemical impedance spectroscopy. The surfaces were examined by SEM and EDX analysis. Cu-Al-Ag alloy shows a potentiodynamic behaviour similar to that of the pure copper electrode while the Cu-Al alloy presents some minor differences. In the active dissolution region the electrodes suffer pitting corrosion and in the other potential regions there are the formation of a passivant film with composition depending on the potential. The impedance responses of the electrodes are discussed. An electrodissolution mechanism is proposed and the effect of the alloying elements upon the impedance response and polarisation curves is explained. The main effects are due to the production of copper and silver chlorides and aluminium oxides/hydroxides at the corroding interface. The addition of Al or (Al + Ag) increases the corrosion resistance of pure copper.