Evidence for “superfilling” of submicrometer trenches with electroless copper deposit
Evidence for “superfilling” of submicrometer trenches with electroless copper deposit
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DOI：
10.1063/1.2712505
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发表时间：
2007-03
影响因子：
4
通讯作者：
Madoka Hasegawa;Noriyuki Yamachika;Y. Shacham-Diamand;Y. Okinaka;T. Osaka
中科院分区：
文献类型：
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作者：
Madoka Hasegawa;Noriyuki Yamachika;Y. Shacham-Diamand;Y. Okinaka;T. Osaka
采用聚乙二醇为抑制剂的化学镀技术，实现了超大规模集成互连结构沟槽的无空洞铜填充。使用该化学镀浴，作者成功地证明了超填充。特别令人感兴趣的是，在填充过程中，沟槽开口处的沉积为零，而底部的沉积非常快。这封信提出了一个示范和证明的超填充沟槽化学镀铜沉积。
Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.