Hybrid additive manufacture: Surface finishing methods for improving conductivity of inkjet printed tracks on non-planar substrates fabricated using fused deposition modeling
Hybrid additive manufacture: Surface finishing methods for improving conductivity of inkjet printed tracks on non-planar substrates fabricated using fused deposition modeling
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DOI：
10.1016/j.sna.2021.113235
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发表时间：
2022-01-07
影响因子：
4.6
通讯作者：
Leigh, Simon J.
中科院分区：
文献类型：
--
作者：
Griffiths, Elliott R.;Leigh, Simon J.
本研究调查了3D打印的非平面表面的表面质量对喷墨打印的银纳米颗粒油墨的导电性的影响，在熔融沉积建模的背景下;一种增材制造（3D打印）。据观察，印刷表面光洁度导致连续性中断，以及降低的和整体差的批次一致性的电导率（SD批次= 16.51 mS/ mm）。因此，为了为高密度、一致性和可重复性的电子轨道铺平道路，必须改善3D打印零件的表面光洁度。为了缓解这一问题，研究了几种精加工方法，CNC加工，非平面喷嘴熨烫和定制加热工具抛光技术。在所有研究的精加工技术中，抛光被确定为最有效的解决方案，其确保了随后印刷的纳米颗粒轨道的整个表面的高且一致的导电性（SDbatch = 2.88 mS/mm）。非平面抛光和非平面印刷电子器件的结合是解锁在3D打印物体和组件中完全嵌入3D电子器件和传感器的可能性的关键。(C)2021爱思唯尔有限公司版权所有。
This study investigates the impact of the surface quality of 3D printed non-planar surfaces on the conductivity of an inkjet-printed silver nano-particle ink, in the context of fused deposition modeling; a type of additive manufacture (3D pritnting). It was observed that the as-printed surface finish resulted in continuity breaks together with reduced and overall poor batch consistency of conductivity (SDbatch = 16.51 mS/ mm). Therefore, to pave the way for high density, consistent and repeatable electronic tracks, the surface finish of as-printed 3D printed parts must be improved. To mitigate this, several finishing methods were investigated, CNC machining, non-planar nozzle ironing and the technique of burnishing with a custommade heated tool. Of all the investigated finishing techniques, burnishing was identified as the most effective solution that ensured a high and consistent conductivity across the surface for subsequently printed nanoparticle tracks (SDbatch = 2.88 mS/mm). The combination of non-planar burnishing and non-planar printed electronics is key to unlocking the possibility of completely embedded 3D electronics and sensors in 3D printed objects and components.(C) 2021 Elsevier B.V. All rights reserved.