Effects of indentation depth on micro hardness and scratch behavior of thin composite laminate
Effects of indentation depth on micro hardness and scratch behavior of thin composite laminate
复制标题
DOI：
10.1016/j.jallcom.2016.04.108
复制
发表时间：
2016-09
影响因子：
6.2
通讯作者：
Hongwei Zhao;Yuexi Zhong;Zhichao Ma
中科院分区：
文献类型：
--
作者：
Hongwei Zhao;Yuexi Zhong;Zhichao Ma
讨论了压痕深度对80 μm厚铜/铝复合材料层板显微硬度和划痕行为的影响。当压痕深度超过板层厚度（C1100铜，10 μm）时，硬度随压痕深度的增加而逐渐降低。当压痕深度增加到较大值时，维氏硬度表现为轻微降低，基材层划伤区微观形貌相对于板层较为光滑平坦。造成显微硬度和划伤行为变化的主要原因是板层和界面粘附抑制了基材层的堆积行为和塑性流动。
The effects of indentation depth on micro hardness and scratch behavior of an 80 μm thick copper/aluminum composite laminate were discussed. When the indentation depth exceeded the thickness of the plate layer (C1100 copper, 10 μm), the measured hardness gradually decreased as the indentation depth increased. When the indentation depth increased to a relatively large value, the Vickers hardness manifested as a slight decrease, and the micro morphology of the scratch zone of the substrate layer was relative smooth and flat compared with the plate layer. The main reasons of the variation of micro hardness and scratch behavior were that the plate layer and interfacial adhesion have restrained the pile-up behaviors and plastic flow of the substrate layer.